Intel announces 32-layer 3D NAND chips, plans for larger-than-10TB SSDs

It’s been clear for several years that three-dimensional NAND die stacking, in which chip layers are oriented vertically as opposed to horizontal planar structures was the way forward for next-generation chip designs. Until now, Samsung has been the only company to take that plunge, but that’s going to change in 2015 with the launch of Intel’s own solution in 2015.

Can Intel steal early momentum from Samsung?

Read the source article at Latest Technology News

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